High Speed Circuit Board Signal Integrity

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High-speed Circuit Board Signal Integrity :

Technology & Engineering

Author - Stephen C. Thierauf
Publisher - Artech House
Pages - 260
ISBN - 9781580538466


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Detail - This leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise circuit design. Discusses both design and debug issues at gigabit per second data rates.

High-speed Circuit Board Signal Integrity :

Technology & Engineering

Author - Stephen C. Thierauf
Publisher - Artech House
Pages - 243
ISBN - 1580531318


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Detail - As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards.

High-Speed Circuit Board Signal Integrity, Second Edition :

Author - Stephen C. Thierauf
Publisher - Artech House Publishers
Pages - 320
ISBN - 9781608079773


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Detail - This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards.Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Signal Integrity Issues and Printed Circuit Board Design :

Technology & Engineering

Author - Douglas Brooks
Publisher - Prentice Hall Professional
Pages - 403
ISBN - 9780131418844


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Detail - Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.

Understanding Signal Integrity :

Electrical engineering

Author - Stephen C. Thierauf
Publisher - Artech House
Pages - 256
ISBN - 1596939826


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Detail - This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, including question and answer sections and bulleted lists.This valuable resource features rules of thumb and simple equations to help you make estimates of critical signal integrity parameters without using circuit simulators of CAD (computer-aided design). The book is supported with over 120 illustrations, nearly 100 equations, and detailed reference lists at the end of each chapter.

High-Speed Circuit Board Signal Integrity, Second Edition :

Technology & Engineering

Author - Stephen C. Thierauf
Publisher - Artech House
Pages - 320
ISBN - 163081444X


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Detail - This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging :

Computers

Author - Xing-Chang Wei
Publisher - CRC Press
Pages - 322
ISBN - 1315305852


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Detail - Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Signal Integrity for PCB Designers :

Printed circuits

Author - Vikas Shukla
Publisher -
Pages - 264
ISBN - 9780982136904


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Detail -

Signal Integrity Characterization Techniques :

Technology & Engineering

Author - Mike Resso, Eric Bogatin
Publisher - Intl. Engineering Consortiu
Pages - 783
ISBN - 9781931695930


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Detail - Cogently addressing the future of signal integrity and the effect it will have on the data-transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional, digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real-world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.

Signal Integrity : Simplified

Technology & Engineering

Author - Eric Bogatin
Publisher - Prentice Hall Professional
Pages - 587
ISBN - 9780130669469


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Detail - This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.

High-speed Digital Design : A Handbook of Black Magic

Technology & Engineering

Author - Howard W. Johnson, Martin Graham
Publisher -
Pages - 447
ISBN - 9780133957242


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Detail - Focused on the field of knowledge lying between digital and analog circuit theory, this new text will help engineers working with digital systems shorten their product development cycles and help fix their latest design problems. The scope of the material covered includes signal reflection, crosstalk, and noise problems which occur in high speed digital machines (above 10 megahertz). This volume will be of practical use to digital logic designers, staff and senior communications scientists, and all those interested in digital design.

Signal and Power Integrity--simplified :

Technology & Engineering

Author - Eric Bogatin
Publisher - Pearson Education
Pages - 757
ISBN - 0132349795


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Detail - The #1 guide to signal integrity, updated with all-new coverage of power integrity, high-speed serial links, and more * * Up-to-the-minute comprehensive guidance: everything engineers need to know to understand and design for signal integrity. * Authored by world-renowned signal integrity trainer, educator, and columnist Eric Bogatin. * Focuses on intuitive understanding, practical tools, and engineering discipline - not theoretical derivation or mathematical rigor. Today's marketplace demands faster devices and systems that deliver more functionality and longer life in smaller packaging. Signal Integrity - Simplified, Second Edition is the first book to bring together all the up-to-the-minute techniques designers need to overcome all of those challenges. Renowned expert Eric Bogatin thoroughly reviews the root causes of all four families of signal integrity problems, and shows how to design them out early in the design cycle. Drawing on his experience teaching 5,000+ engineers, he illuminates signal integrity, physical design, bandwidth, inductance, and impedance; presents practical tools for solving signal integrity problems; and offers specific design guidelines and solutions. In this edition, Bogatin adds extensive coverage of power integrity and high speed serial links: topics at the forefront of signal integrity design. Three new chapters address: * * Designing power delivery networks to support high-speed signal processing. * Using 4-Port S-parameters, the emerging standard for describing interconnects in high speed serial links. * Working with today's measurement and simulation tools and technologies